ASML Expands into AI Chip Packaging Amid Record Growth

ASML Holding NV, the sole producer of extreme ultraviolet lithography machines, is pivoting toward advanced chip packaging—a critical frontier for artificial intelligence hardware. The Dutch firm's $400 million High-NA EUV systems have already processed 500,000 wafers, though full-scale production remains 2–3 years away for most chipmakers.

The strategic shift comes as Nvidia Corp. and Advanced Micro Devices Inc. increasingly adopt 3D chip designs that resemble stacked skyscrapers rather than traditional flat architectures. ASML's light source technology could boost semiconductor output by 50% before 2030, with prototypes reaching 2,000 watts of power.

Financial results underscore the momentum: $39.16 billion in 2025 net sales and an $11.5 billion profit, supported by a $46.47 billion order backlog. Shares have surged 30% year-to-date and 106% over twelve months, reflecting Wall Street's confidence in ASML's dual dominance of lithography and emerging packaging markets.